Samsung expected to more than double HBM4 and HBM4E memory output in 2026 as AI chip demand rises

Samsung Electronics is reportedly preparing to scale production of its HBM4 and HBM4E high-bandwidth memory chips next year, with glass carrier cleaning volumes rising from 20,000 to 50,000 sheets per month. Industry sources say the increase strongly suggests HBM4 family output could more than double as Samsung focuses on 12-layer and higher stack products.

The planned expansion shows Samsung is racing to regain momentum in advanced memory as AI accelerators drive demand for higher-capacity, higher-bandwidth DRAM. Growth in supporting materials like glass carriers also highlights how packaging and wafer-thinning capacity are becoming key bottlenecks in the AI semiconductor supply chain.